Nano-size copper oxide encapsulated urea – formaldehyde resin film for arsenic (III) removal from aqueous solutions

Abstract

The nano-size copper oxide with 40-50 nm dimensions was prepared through KNO₃: NaNO₃ eutectic melt and encapsulated in urea – formaldehyde (UF) resin during polymerisation. Particle size of CuO was determined by XRD and SEM techniques. CuO encapsulated in urea – formaldehyde resin in the form of film (~5 mm thickness) was used to remove As (III) content from aqueous solution. The process of As (III) removal was found to be efficient and cost effective.