Browsing by Author Manohar, Bottumanchi Morish
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Title | Author(s) | Source | Page(s) |
---|---|---|---|
Cu-Cu thermo compression wafer bonding techniques for micro-system integration | Agrawal, Megha; Manohar, Bottumanchi Morish; Nagarajaiah, Kusuma | IJEMS Vol.28(2) [April 2021] | 142-151 |