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IJPAP Vol.46(03) [March 2008] >


Title: Growth and characterization of copper, indium and copper-indium alloy films non-aqueous method of electrodeposition
Authors: Kumar, S R
Prajapati, B
Tiwari, S K
Tiwari, V K
Keywords: Non-aqueous medium
Electrodeposition
Cathodic polarization
Stoichiometry
Survey scans
Sputtering
Issue Date: Mar-2008
Publisher: CSIR
Abstract: A new non-aqueous method for electrodeposition of copper, indium and copper indium alloy films, ethylene glycol has been used as the solvent which is non-toxic and non-hazard bath. All the source materials are readily soluble in this bath and they have higher working temperature (≥160°C). The copper films prepared in ethylene glycol based bath are preferred (111) oriented with grains well connected to each other indicates the epitaxial growth. The indium film has been observed in semi-molten state with intense (101) reflection. The Cu-In alloy film prepares at –1.1 V (Pt) is copper rich but the ratio tends to be1.0 in the bulk of the film. Multiphase deposits are observed with grains which are spherical and well connected to each other. The resistivity and carrier concentration of the as-deposited copper and copper indium alloy films are found to be 0.2 Ω-cm, 9.9x10¹⁵ per cm³ and 2.5 Ω-cm and 5.5x10¹⁷per cm³, respectively. The as-deposited films are found to be resistive but the resistance decreases when the films are annealed at moderate temperature.
Page(s): 198-203
ISSN: 0019-5596
Source:IJPAP Vol.46(03) [March 2008]

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