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Title: Advances in the applied chemistry of allylic polymers
Authors: Menon, C C
Selvaraj, A
Keywords: Diallyl phthalate polymer;Epoxy resin adhesive;Bond strength
Issue Date: Apr-2004
Publisher: CSIR
IPC Code: Int. Cl.7: B 27 K 3/08, C 01 B1 13/18
Abstract: Investigation of diallyl phthalate polymer (DAPP) based moulding powder with partial substitution of DAPP by epoxidisied DAPP polymer (EDAPP) indicates improvement in mechanical properties without detriment to electrical strength. Peak performance is manifested at 20 per cent substitution. EDAPP is also found to be an effective reactive diluent for cold setting epoxy resin adhesives. Bond strength is observed to be unaffected by extension up to 40 per cent. Hardboard (Fibre board) modified by DAPP as an impregnant results in a novel wood-polymer composite with tangible improvement of density, electrical strength, modulus of rupture and reduced water absorption having varied applications.
Page(s): 365-375
ISSN: 0975-1084 (Online); 0022-4456 (Print)
Appears in Collections:JSIR Vol.63(04) [April 2004]

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