Please use this identifier to cite or link to this item: http://nopr.niscair.res.in/handle/123456789/42674
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dc.contributor.authorBhardwaj, Sanjay-
dc.contributor.authorPadmanabham, G.-
dc.contributor.authorJain, Karuna-
dc.contributor.authorRao, D. Srinivasa-
dc.contributor.authorJoshi, Shrikant V.-
dc.date.accessioned2017-08-31T09:24:32Z-
dc.date.available2017-08-31T09:24:32Z-
dc.date.issued2017-05-
dc.identifier.issn0975-1076 (Online); 0971-7544 (Print)-
dc.identifier.urihttp://nopr.niscair.res.in/handle/123456789/42674-
dc.description154-167en_US
dc.description.abstractThis study is aimed at developing insights into the Technology Value Chain (TVC) of advanced materials-based technologies using a scenario in which technology has been transferred by a Research and Technology Organization (RTO) to a Small and Medium Enterprise (SME) in the Indian context. A Conceptual Theoretical Model (CTM) using constructs from existing TVC models is used as a basis for the case study described in this paper. This model is refined using actual evidence from an Indian RTO - the International Advanced Research Centre for Powder Metallurgy and New Materials (ARCI), Hyderabad. The TVC of ARCI's proprietary Detonation Spray Coating (DSC) technology is used to expand upon the CTM as well as to provide new insights wherever possible. The TVC adopted for DSC includes technology incubation and proof of concept in advance of transferring the technology. These strategies, aided by government funding of the technology recipient companies, were observed to play an important role in successful commercialization.en_US
dc.language.isoen_USen_US
dc.publisherNISCAIR-CSIR, Indiaen_US
dc.rights CC Attribution-Noncommercial-No Derivative Works 2.5 Indiaen_US
dc.sourceJIPR Vol.22(3) [May 2017]en_US
dc.subjectTechnology commercializationen_US
dc.subjectTechnology value chainen_US
dc.subjectAdvanced materials technologiesen_US
dc.subjectDetonation spray coatingen_US
dc.titleTechnology Commercialization in Advanced Materials Sector: Indian Contexten_US
dc.typeArticleen_US
Appears in Collections:JIPR Vol.22(3) [May 2017]

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