NISCAIR Online Periodicals Repository

Research Journals >
Indian Journal of Pure & Applied Physics (IJPAP) >
IJPAP Vol.47 [2009] >
IJPAP Vol.47(03) [March 2009] >

Title: Microstructure based model for effective thermal conductivity of snow
Authors: Singh, Ashok K
Wasankar, K S
Keywords: Microstructure
Thermal conductivity
Heat transfer
Issue Date: 2009
Publisher: CSIR
Abstract: The paper presents a model to quantitatively relate macroscopic effective thermal conductivity (ETC) of snow with the microscopic interfacial contact area among the components using micro-structural parameters obtained from surface section images of snow samples. Unit cell model of Jackson and Black, based on stereological concept of contiguity, is expanded to include the effect of microstructure of snow, as well as, other parameters to predict the ETC of snow. The model is described by three dominant thermal conductance that account for the heat transfer across solid-solid, solid-liquid, and solid-air interface. The complex structure of snow is described using the primary microstructure parameters: coordination number, grain size, bond size, dendricity and sphericity. The ETC formulations developed, include the effect of these snow parameters besides the characteristics of the phases and temperature dependence of their conductivities. The model predictions agree closely with the measurements made using transient thermal probe method. The ETC values obtained from the present model are in close agreement with the observed values than the results of other existing models.
Page(s): 206-211
ISSN: 0019-5596
Source:IJPAP Vol.47(03) [March 2009]

Files in This Item:

File Description SizeFormat
IJPAP 47(3) 206-211.pdf631.82 kBAdobe PDFView/Open
 Current Page Visits: 117 
Recommend this item


Online Submission of Articles |  NISCAIR Website |  National Knowledge Resources Consortium |  Contact us |  Feedback

Disclaimer: NISCAIR assumes no responsibility for the statements and opinions advanced by contributors. The editorial staff in its work of examining papers received for publication is helped, in an honorary capacity, by many distinguished engineers and scientists.

CC License Except where otherwise noted, the Articles on this site are licensed under Creative Commons License: CC Attribution-Noncommercial-No Derivative Works 2.5 India

Copyright © 2015 The Council of Scientific and Industrial Research, New Delhi. All rights reserved.

Powered by DSpace Copyright © 2002-2007 MIT and Hewlett-Packard | Compliant to OAI-PMH V 2.0

Home Page Total Visits: 170264 since 01-Sep-2015  Last updated on 30-Jun-2016Webmaster: