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Title: Low temperature development of Pongamia glabra seed oil based polyesteramide without organic solvent
Authors: Zafar, Fahmina
Ashraf, S M
Ahmad, Sharif
Issue Date: Jun-2007
Publisher: CSIR
Abstract: Seed oils are expected to be an ideal alternative renewable resource to petroleum-based raw materials since they are inexpensive, non-toxic, biodegradable and relatively harmless to the environment as well as are found in abundance over the world. Pongamia glabra seed oil a non-edible and non-drying oil has found application as alkyds, epoxies and polyesteramide based protective paints and coating materials. Pongamia glabra seed oil based polyesteramide was synthesized at lower temperature (85±5°C) in the absence of organic solvent through condensation polymerization reaction [Sf-PGPEA]. In this reaction N, N, bis- (2 hydroxyethyl) pongamia glabra fatty amide [HEPGA] and phthalic anhydride [PAl were heated at temperature lower than their onset of melting points and the by-product such as water was removed by application of vacuum technique. This approach was employed to overcome the use of volatile organic contents [VOCs] used during processing and application of resin, which are ecologically harmful as well as convert the non-edible oil into value added product. The FTIR, ¹H-NMR and ¹³C-NMR spectral techniques were used to confirm the structure of Sf-PGPEA. The physico-chemical, physico-mechanical and chemical resistance properties of the resin were investigated by standard methods. DSC and TGA were used to determine respectively the curing behaviour and thermal stability of the resin. The comparative study of these properties of Sf-PGPEA with reported polyesteramide [PGPEA], which are normally synthesized at higher temperature in organic solvent, was done. It was found that Sf-PGPEA exhibited improved physico-mechanical, chemical resistance properties and higher thermal stability compared to PGPEA, and hence can find application as corrosion protective eco-friendly coating material.
Page(s): 44-50
ISSN: 0771-7706
Appears in Collections:BVAAP Vol.15(1) [June 2007]

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