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Title: Wafer bonding — A powerful tool for MEMS
Authors: Bhat, K N
Gupta, A Das
Rao, P R S
Gupta, N Das
Bhattacharya, E
Sivakumar, K
Kumar, V Vinoth
Anitha, L Helen
Joseph, J D
Madhavi, S P
Natarajan, K
Keywords: Silicon fusion bonding;Silicon on insulator;Piezoresitive pressure sensor;MOSFET amplifier integration with sensor
Issue Date: Apr-2007
Publisher: CSIR
IPC Code: B81B7/02
Abstract: Wafer bonding techniques play a key role in the present day silicon bulk micromachining for MEMS based sensors and actuators. Various silicon wafer bonding techniques and their role on MEMS devices such as pressure sensors, accelerometers and micropump have been discussed. The results on the piezoresistive pressure sensors monolithically integrated with a MOSFET differential amplifier circuit have been presented to demonstrate the important role played by the Silicon Fusion Bonding technique for integration of sensors with electronics on a single chip.
Page(s): 311-316
ISSN: 0019-5596
Appears in Collections:IJPAP Vol.45(04) [April 2007]

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