Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/19719
Title: Effect of N2 -plasma exposure on corrosion of copper wire
Authors: Singh, N P
Gupta, S C
Sood, B R
Issue Date: Feb-2002
Publisher: NISCAIR-CSIR, India
Abstract: Corrosion of industrial materials is a slow ongoing process due to aggressive environment. In order to simulate this process in the laboratory, corrosion of annealed copper wire and N2 plasma exposed copper wire by dilute nitric acid has been investigated by monitoring the resistance of copper wire as the corrosion proceeded over eight days period. From resistance measurement as a function of time, corrosion rate (decrease in wire diameter) in m/h for annealed and N2 plasma exposed wire has been evaluated. It is observed that the rate of corrosion for the plasma- irradiated wire is less than that that observed for unexposed annealed wire. The present investigations clearly point towards the possible use of plasma-based surface engineering processes for corrosion protection and possibly for producing wear resistant materials.
Page(s): 83-84
ISSN: 0975-1017 (Online); 0971-4588 (Print)
Appears in Collections:IJEMS Vol.09(1) [February 2002]

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