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Title: A comparison of lifted lead defect inspection system for surface mount technology
Authors: Ramli, Rizauddin
Wahab, Dzuraidah Abd
Ghani, Jaharah Abd
Zain, Raime M
Keywords: Lifted lead defect
Surface mount technology (SMT)
Vision camera
Issue Date: May-2012
Publisher: NISCAIR-CSIR, India
Abstract: This study presents development of an automated lead defect inspection system by using Visual Mechanical Inspection Scanner (VMIS) in semiconductor industry. In any device seated out of cavity, VMIS detects misplacement error (ME), a quality defect in surface mount technology (SMT). ME causes a lifted lead defect on lead packages. MEs that can be analyzed are of two kinds: i) device seated out of cavity; and ii) double devices imbedded in the same cavity. The system was successfully tested on devices with 90% accuracy of inspection. Thus VMIS can inspect device seated out of cavity and hence prevents lifted lead from occurring.
Page(s): 330-333
CC License:  CC Attribution-Noncommercial-No Derivative Works 2.5 India
ISSN: 0975-1084 (Online); 0022-4456 (Print)
Source:JSIR Vol.71(05) [May 2012]

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