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Indian Journal of Engineering and Materials Sciences (IJEMS) >
IJEMS Vol.18 [2011] >
IJEMS Vol.18(5) [October 2011] >
| Title: | Nano-size copper oxide encapsulated urea – formaldehyde resin film for arsenic (III) removal from aqueous solutions |
| Authors: | Rastogi, R P
Singh, N B
Shukla, S K |
| Keywords: | Copper oxide
Nanoparticles
Arsenic
Urea-formaldehyde
XRD
SEM |
| Issue Date: | Oct-2011 |
| Publisher: | NISCAIR-CSIR, India |
| Abstract: | The nano-size copper oxide with 40-50 nm
dimensions was prepared through KNO3: NaNO3 eutectic melt
and encapsulated in urea – formaldehyde (UF) resin during polymerisation.
Particle size of CuO was determined by XRD and SEM techniques. CuO encapsulated
in urea – formaldehyde resin in the form of film (~5 mm thickness) was used to
remove As (III) content from aqueous solution. The process of As (III) removal
was found to be efficient and cost effective. |
| Page(s): | 390-392 |
| CC License: |  CC Attribution-Noncommercial-No Derivative Works 2.5 India |
| ISSN: | 0975-1017 (Online); 0971-4588 (Print) |
| Source: | IJEMS Vol.18(5) [October 2011]
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