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Title: Nano-size copper oxide encapsulated urea – formaldehyde resin film for arsenic (III) removal from aqueous solutions
Authors: Rastogi, R P
Singh, N B
Shukla, S K
Keywords: Copper oxide
Issue Date: Oct-2011
Publisher: NISCAIR-CSIR, India
Abstract: The nano-size copper oxide with 40-50 nm dimensions was prepared through KNO3: NaNO3 eutectic melt and encapsulated in urea – formaldehyde (UF) resin during polymerisation. Particle size of CuO was determined by XRD and SEM techniques. CuO encapsulated in urea – formaldehyde resin in the form of film (~5 mm thickness) was used to remove As (III) content from aqueous solution. The process of As (III) removal was found to be efficient and cost effective.
Description: 390-392
ISSN: 0975-1017 (Online); 0971-4588 (Print)
Appears in Collections:IJEMS Vol.18(5) [October 2011]

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