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| Title | Author(s) | Source | Page(s) |
|---|---|---|---|
| Nano-size copper oxide encapsulated urea – formaldehyde resin film for arsenic (III) removal from aqueous solutions | Rastogi, R P; Singh, N B; Shukla, S K | IJEMS Vol.18(5) [October 2011] | 390-392 |
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